CDA GmbH
Operation name
2015 FE 9161
2015 FE 9161
Operation summary
Implementation of integrated circuit packaging for the integration of polymer substrates with silicon chips and their contacting by means of printed electronics, as well as additional integration of light-conducting structures or components
Implementation of integrated circuit packaging for the integration of polymer substrates with silicon chips and their contacting by means of printed electronics, as well as additional integration of light-conducting structures or components
Operation start date
01.06.2016
01.06.2016
Operation end date
31.05.2019
31.05.2019
Total eligible expenditure allocated to the operation
12.608,09
12.608,09
Union co-financing rate
80 %
80 %
Operation postcode
98529
98529
Country
Deutschland
Deutschland
Name of category of intervention
062 - Technology transfer and cooperation between universities and companies, especially for the benefit of SMEs
062 - Technology transfer and cooperation between universities and companies, especially for the benefit of SMEs